By John G. Webster (Editor)
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Extra info for 17.Dielectrics and Electrical Insulation
The MAT chip is a design that employs a different geometry of design for the anode structure, offering more surface area and requiring lower depth penetration into the volume of the anode. This allows the maximum limit now to drop to 30 m⍀. The next offering will be the MAT chip with a conductive polymer replacing the manganese dioxide as the cathode plate. MnO2 has been used exclusively in the solid tantalum capacitor because it offers a self-healing effect with these devices. At a fault site in the Ta2O5, the current is localized and high through the MnO2, allowing a conversion of the MnO2 to a higher resistive state such as Mn2O3.
An example of the projected increase in energy density of electrostatic and electrochemical capacitors for use in switched-mode power supplies is illustrated in the trend plot of Figure 2 (2,8,13–15). Achieving the power densities, at, say, an operational frequency of 10 kHz, of between 10 MVAR Table 4. 5 3ϫ 1ϫ–10ϫ (size dependent) Presently available capacitor performance parameter ranges available in the commercial marketplace. Short-term ac duty. CAPACITOR INSULATION circuit’s critical stress point.
10–3 Type of capacitor est (ӷ1 MHz) can cost-effective designs of such power systems be practical for both the international marketplace and domestic use (7,14,15). Ceramics presently appear to be one intrinsically high-temperature, and hence long-lived, technology available with a very large potential for advancement, particularly with the recent advent of new materials and the multilayer ceramic capacitor’s (MLC) demonstrated production capacitance and voltage scalability (ӷ 100 ȐF, Ͼ 500 WVdc (11).
17.Dielectrics and Electrical Insulation by John G. Webster (Editor)